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J. Appl. Electrochem.Electrochemical stripping of gold from Au-Ni-Cu electronic connector scrap in an aqueous solution of thiourea

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JAE Describes laboratory study of electrochemical stripping of Au from Au-Ni-Cu connector scrap in HCl soln of 2.5 % thiourea at constant potentials of 9,15-0.50V vs SCE. Selective dissoln of Au was observed at 0.2-0.3V in 30 min. <0.25V thiourea was oxidized.

Jahrbuch Oberflaechentechnik

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Yearbook with chapters on overview of European scene, electrodeposition of metals from melts (molten salts); iron phosphating with organic coating, paint or powder; electroplated coatings for wear reduction. Modelling electrodeposition of rough & smooth surfaces (levelling). Electrodeposition of gold, silver & platinum for technical applications; alloy electrodeposition; electrodeposition of less common coating metals. Deposition & properties of nickel-phosphorus composite coatings. Selective plating. Electroless & displacement plating of metals. Printed circuit board technology - direct metallising. Plasma coating processes, wear resistance with super-hard carbon; pulse plasma surface treatment. Duplex coatings of electroplate with PVD chromium nitride. Mass production of automotive solar protective coatings on glass. Hot dip galvanising & thermal spraying. Vitreous enamelling from an ecological aspect. Laser-arc coating and laser glazing & melting. Electroless metallising for fine pattern structures. LIGA electroforming process for infra-red filters on Space Station; Energy dispersive X-Ray with polarised radiation in surface studies. Predictions from friction & wear measurements. X-ray diffraction at thin films - some experiences. Micro-X-ray diffraction in the semiconductor industry. Secondary neutral particle mass spectrometry for surface studies in industry. Quality assurance by monitoring mechanical properties of coatings.

Jahrbuch Schleifen, Hohnen, Lappen und Polieren (Yearbook for grinding, honing, lapping and polishing)

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Jakobi bicentenary conference

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Short note on major Russian conference celebrating history of one of the first electroplaters, where a extensive program of lectures on electrochemistry & surface finishing was presented,

Japan and some Asian competitions.

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Japan Printed Circuit Ass'n Show - Microvias carry the day

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Report on major Japanese show covers laser vias, photovias and other microvia technologies. Section on imageing, high-performance laminates.

Japan's flex printed circuit board production

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Table gives statistics 1992-1995 for top 10 Japanese flex mfrs by value.

Japan's printed circuit board industry

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Market statistics are shown, broken down as flex, rigid and IC substrate (turnover in yen, 2004-6). Also plastic flip-chip with market sector (PC, games etc) in millions. Japanese production overseas is also noted and investment by 12 major JP companies is listed (in US$). Similar data for pcb laminates & substrates. The 34 largest JP pcb mfrs are listed with data and tables give JP trade statistics for the pcb sector, Future trends are forecast.

Japanese Current Practices & Trends In Light Metals Finishing

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Japanese Current Practices and Trends in Light Metals Finishing

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Japanese dominate world microvia production

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Note on "TechSearch International" study report "Markets for High-Density Microvia substrates" reveals that Japanese companies hold over 60% market share. Market statistics & projections are noted.

Japanese printed circuit board industry

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An overview with numerous tables giving production statistics, including trends, 2005 to 2013, broken down by board types. Data is compared with global trends. 25 top Japanese companies are ranked by size. Photos show some plants and commentary is offered on technical development trends.

Japanese Printed Circuit Board Show, 1999

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Report on JPCA Show with table listing materials for build-up processes (RCC = resin clad copper foil), & listing of thermally cureable resins for laser drilling. Comment &table listing of photodielectric materials and other substrates incl. "halogen free" or "green" variants. Equipment incl. laser drilling' step-and-repeat illuminators, roll-coater for liquid innerlayer photoresist, contactless testing, laser direct illumination, horizontal pcb plating machines. Comment & statistics on pcb manufacturers. Last word - "Always the same - everything different".

Japanese technology for coating & finishing aluminium for architectural use

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Al anodising, showing vertical plants favoured in Japan, with process flow sheets contrasting French & Japanese practice. Process flowsheet shows aluminium ion recovery (as alumina) in rinse stage, and comments on colouring, statistics on anodising throughput, costs and summary of accelerated tests used in Japan.

Japanese Temple Carving Rubbing is Early Record of Plating

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History news item on rubbing from Japanese temple which apparently records first reference to plating in AD 600. Type of plating not mentioned. Photo shows rubbing.