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| abstract | |
| J. Appl. Electrochem.Electrochemical stripping of gold from Au-Ni-Cu electronic connector scrap in an aqueous solution of thiourea | |
| JAE Describes laboratory study of electrochemical stripping of Au from Au-Ni-Cu connector scrap in HCl soln of 2.5 % thiourea at constant potentials of 9,15-0.50V vs SCE. Selective dissoln of Au was observed at 0.2-0.3V in 30 min. <0.25V thiourea was oxidized. | |
| Jahrbuch Oberflaechentechnik | |
| Yearbook with chapters on overview of European scene, electrodeposition of metals from melts (molten salts); iron phosphating with organic coating, paint or powder; electroplated coatings for wear reduction. Modelling electrodeposition of rough & smooth surfaces (levelling). Electrodeposition of gold, silver & platinum for technical applications; alloy electrodeposition; electrodeposition of less common coating metals. Deposition & properties of nickel-phosphorus composite coatings. Selective plating. Electroless & displacement plating of metals. Printed circuit board technology - direct metallising. Plasma coating processes, wear resistance with super-hard carbon; pulse plasma surface treatment. Duplex coatings of electroplate with PVD chromium nitride. Mass production of automotive solar protective coatings on glass. Hot dip galvanising & thermal spraying. Vitreous enamelling from an ecological aspect. Laser-arc coating and laser glazing & melting. Electroless metallising for fine pattern structures. LIGA electroforming process for infra-red filters on Space Station; Energy dispersive X-Ray with polarised radiation in surface studies. Predictions from friction & wear measurements. X-ray diffraction at thin films - some experiences. Micro-X-ray diffraction in the semiconductor industry. Secondary neutral particle mass spectrometry for surface studies in industry. Quality assurance by monitoring mechanical properties of coatings. | |
| Jahrbuch Schleifen, Hohnen, Lappen und Polieren (Yearbook for grinding, honing, lapping and polishing) | |
| Jakobi bicentenary conference | |
| Short note on major Russian conference celebrating history of one of the first electroplaters, where a extensive program of lectures on electrochemistry & surface finishing was presented, | |
| Japan Printed Circuit Ass'n Show - Microvias carry the day | |
| Report on major Japanese show covers laser vias, photovias and other microvia technologies. Section on imageing, high-performance laminates. | |
| Japan's flex printed circuit board production | |
| Table gives statistics 1992-1995 for top 10 Japanese flex mfrs by value. | |
| Japan's printed circuit board industry | |
| Market statistics are shown, broken down as flex, rigid and IC substrate (turnover in yen, 2004-6). Also plastic flip-chip with market sector (PC, games etc) in millions. Japanese production overseas is also noted and investment by 12 major JP companies is listed (in US$). Similar data for pcb laminates & substrates. The 34 largest JP pcb mfrs are listed with data and tables give JP trade statistics for the pcb sector, Future trends are forecast. | |
| Japanese Current Practices & Trends In Light Metals Finishing | |
| Japanese Current Practices and Trends in Light Metals Finishing | |
| Japanese dominate world microvia production | |
| Note on "TechSearch International" study report "Markets for High-Density Microvia substrates" reveals that Japanese companies hold over 60% market share. Market statistics & projections are noted. | |
| Japanese Printed Circuit Board Show, 1999 | |
| Report on JPCA Show with table listing materials for build-up processes (RCC = resin clad copper foil), & listing of thermally cureable resins for laser drilling. Comment &table listing of photodielectric materials and other substrates incl. "halogen free" or "green" variants. Equipment incl. laser drilling' step-and-repeat illuminators, roll-coater for liquid innerlayer photoresist, contactless testing, laser direct illumination, horizontal pcb plating machines. Comment & statistics on pcb manufacturers. Last word - "Always the same - everything different". | |
| Japanese technology for coating & finishing aluminium for architectural use | |
| Al anodising, showing vertical plants favoured in Japan, with process flow sheets contrasting French & Japanese practice. Process flowsheet shows aluminium ion recovery (as alumina) in rinse stage, and comments on colouring, statistics on anodising throughput, costs and summary of accelerated tests used in Japan. | |
| Japanese Temple Carving Rubbing is Early Record of Plating | |
| History news item on rubbing from Japanese temple which apparently records first reference to plating in AD 600. Type of plating not mentioned. Photo shows rubbing. | |
| Jar Tester for Effluent Treatment Assessment | |
| Au. extols simple, portable device consisting of 4 x 1 Liter beakers or jars, each with o/head electrically powered paddle stirring mechanism. The jars are illuminated from below, allowing one to inspect settling or other precipitation processes taking place. The device is used to screen a range of effluent or sludge treatment procedures, and additives such as flocculating agents. Tables show typical testing strategies. 2 refs | |
| Jena laser direct exposure is successfully tested at ILFA | |
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