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| abstract | |
| F006 Compositional characterisation a generation after listing | |
| US environmental legislation, esp. Clean Water Act (CWA) & Resource Conservation & Recovery Act (RCRA) which embodies waste code F006. General background comments are given, with long tables listing specific compounds, their EPA & CAS numbers, regulatory levels (concentrations), details of effluent treatment tests; ASTM leaching tests. Checklist identifies pollution prevention technologies. Detailed treatment of cadmium, cyanides, chromium. Comments on residual latent financial value in heavy metal sludges. 16 refs | |
| Fab for TAB (Tape Automated Bonding) | |
| Title process is explained in terms of die level, tape with sprocket holes and multi-layer bump circuitry, inner lead bonding testing & excising. | |
| Fabric comprising metal-coated fibres. | |
| Fabric comprising metal-coated fibres wherein the metal-coated fibres are capable of providing shielding from electromagnetic radiation, in particular clothing made from a fabric comprising metal -coated fibres, wherein the clothing provides shielding from electromagnetic radiation. | |
| Fabric for Abrasive Flapwheels | |
| Fabric metallizing method | |
| Method consists in bending tensioned fabric at angle of 90-100°, spray coating bending zone with aluminium, and reverse profile change at 450-470°C. To increase adhesion, after spray coating metallized fabric is subjected to pulsed magnetic field in bending zone. | |
| Fabric with a moistureproof, dustproof, and antibacterial function | |
| Fabric having a three-layered structure: a fiber substrate, a parylene layer, and an antibacterial layer. The fiber substrate is the fiber part of the fabric; the parylene layer is capable of providing a moistureproof and dustproof effect as well as preventing the fiber substrate from being catalyzed by photocatalyst and decomposed thereby; the antibacterial layer, which comprises nano-photocatalyst and/or nano-silver particles, is used to kill pathogenic germs. | |
| Fabricated Titanium Article having Improved Corrosion Resistance. | |
| Item is attached directly or indirectly to a platinum group metal or alloy, or these are incorporated into the item. | |
| Fabricated Titanium Article having Improved Corrosion Resistance. | |
| Titanium article having improved corrosion resistance resulting from a direct or indirect attachment of a platinum group metal or alloy thereof or incorporation of this metal or alloy thereof into a minor surface portion of the article. | |
| Fabricating a circuit board body with aid of conductive filler and paste | |
| Method comprises producing conductive filler comprising metal powder which is vibrated while sputtering low m.pt metallic layer; mixing filler with matrix resin to obtain conductive paste, which is applied and heated to form conductive layer. | |
| Fabricating a contact rhodium structure by electroplating and electroplating composition. | |
| A contact rhodium structure is fabricated by a process that comprises obtaining a substrate having a dielectric layer thereon, wherein the dielectric layer has cavities therein into which the contact rhodium is to be deposited; depositing a seed layer in the cavities and on the dielectric layer; and depositing the rhodium by electroplating from a bath comprising a rhodium salt; an acid and a stress reducer; and then optionally annealing the structure. | |
| Fabricating a metallized film | |
| Method comprises vaporizing metal, evaporation preventing agent and depositing it directly on film through screen to form pattern on film; evaporating metal and depositing it on patterned film | |
| Fabricating a metallized film capacitor | |
| Device for fabricating metallized film capacitor comprises roll holding film; tank in which metal deposition inhibitor is vapourized; cylinder with side wall comprising screen with evaporated pattern; and conduit through which vaporised metal inhibitor is transported from tank to cylinder interior causing direct deposition of inhibitor to be deposited through screen onto film. | |
| Fabricating a Micro-Hole in a Reinforced Flat Component | |
| Fabricating a semiconductor device | |
| Method comprising forming crystalline silicon film on substrate; selectively forming amorphous portion in film; and pref. etching amorphous portion at faster rate than that of etching crystalline Si film. | |
| Fabricating a switching device by anodizing | |
| Method for fabricating switching device by anodizing in which insulating film formed by anodizing is interposed between lower and upper electrodes. | |
