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80% Increase in Turnover in Use of Electroless Nickel
Report on company with E/N line, describing this, & ion exchange & effluent treatment procedures. List of applications.
893,00 DM saved by paint recovery
8th AESF/EPA Conference on Pollution Control for the Metal Finishing Industry
Abstracts from Conference, 188.8.131.527, San Diego, CA, including: E.P. Hall (Metals Industry Branch, Office of Water Regulations and Standards, US. EPA, Washington, DC): Status of water regulations; A.E. Vervaert (Emissions and Engineering Div., Office of Air Quality Planning and Standards, US. EPA, Research Triangle Park, NC) Status of air regulations; M. Straus (Waste Identification Branch, Office of Solid Waste, US. EPA, Washington, DC): Status of RCRA; C.J. Dial (Alternative Technology Div.,m Hazardous Waste Engineering Research Lab., Cincinnati, OH): Hazardous-waste research pertaining to metal finishing; L.G. Twidwell, D.R. Dahnke and W.L. Huestis (Montana College of Mineral Science and Technology, Butte, MT):Pilot-scale results of metal value recovery from mixed metal hydroxide sludges; D.E. Renard (US Army Toxic and Hazardous Materials Agency, Aberdeen, MD): Plating waste sludge metal recovery; D. Grosse (US EPA HWERL, Alternative Treatment Branch, Cincinnati, OH) and S. Hassan and J.E. Park (University of Cincinnati, Cincinnati, OH): Treatment of aqueous metal- and cyanide-bearing hazardous wastes; D.T. Walker (UNOCAL Corporation, Schaumburg, IL): Wastewater pollution abatement and control: a new perspective; M.E. Gold (Wolf, Block, Schoor and Solis-Cohen, Philadelphia, PA): Liability for managing hazardous wastes: past, present and future; W.J. Gancarz and M.C. Possidento (HRP Assoc. Inc., New Britain, CT): How clean is clean? (What constitutes the clean closure of a hazardous-waste land management facility?); C. Ahlstrom and F. McCann (Stanley-Proto Industrial Tools, Wichita Falls, TX): Installation of a new nickel/chromium plating facility; R.M. Woods (Eastern Plating, Inc., Newport, TN): The use of room-temperature evaporators to supplement a chemical destruct system; G. Louchart (Howard Plating Industries, Madison Heights, MI): Howard Plating cleans up its act with magnesium hydroxide; R.V. Bazza (United Engineers & Constructors Inc., Boston MA), C. Kelleher (Texas Instruments, Paramus, NJ) and M.B. Yeligar (Permutit Co. Inc.,Paramus, NJ) Metal Finishing wastewater treatment upgrade with an insoluble sulphide precipitation process; S. Taylor and T Schgurter (Data General, Clayton, NC) and B. Rubin (North Caroline State Univ., Agricultural Extension Service, Raleigh ,NC): Electroplating wastewater treatment: more than just clean water; F. Altmayer (Scientific Control Laboratories, Chicago, IL): A critical examination of wastewater test kits; R.S.J> Naguit (Superior Metal Products, Lima, OH): Application of statistical process control (SPC) to wastewater pretreatment; H. L. Martin, P.K. Gurney and L.P. Fernandez (E.I. Du Pont de Nemours & Co., Savannah River Plant, Aiken, SC): Wastewater reduction in metal fabrication operations; K.O. Gill (Harris Corp., Government Systems Sector, Melbourne, FL): Wastewater treatment; optimizing an existing system; D.E. Bailey and M. Chan (Baker Bros./Systems, Stoughton, MA) Electrolytic recovery: theory, applications, advantages; D.J. Lee (Aneptek Corp., Wayland, MA): Waste treatment and recycling of mixed wastewater from a metal finishing company; R.S. Capaccio and A.J. Cunningham (Mabbett, Capaccio & Assoc., Cambridge, MA): Environmental auditing; management's key to effective environmental compliance; C.H. Darvin (Air and Energy Engineering Research Lab., US. EPA, Research Triangle Park, NC): Optimizing transfer efficiency of painting operations; R. Frey (Finish Engineering Co., Erie, PA): Successful recovery of solvent; C G. Piner (Naval Air Rework Facility, Cherry Point, NC); Reduction of waste in a paint-stripping operation); D.T. Girvan (Sealed Power Corp.,Muskegon, MI): Chromium emissions from scrubber exhausts: a study.
8th William Blum Lecture. Mechanism of the Plating Process
Effect of cleanliness on Tafel slopes (for metal dep'n) and on cathodic efficiency, is shown. Slopes are a function of pre-treatment and cleanliness and double layer capacity also reflects this. The adhesion of H bubbles in soiled areas is shown. Some data for pulse dep'n of Ni is also shown, in the same context. 18 refs.
8th Workshop on Plasma Technology
Report on event at TU Ilmenau, 22-3 June. Summary of lectures on modelling of plasma arcs & thermal arcs; novel diagnostic criteria for arc plasma spraying; particle shape imaging; enthalpy probe meas'ts in a supersonic induction plasma jet; first use of inductive coupled plasma generator by a jobbing coater; combined plasma & laser coating; plasma melting of steel; numerical simulation in plasma melt cutting; modelling plasma-CVD diamond coating; use of non-equilibrium plasmas; movement of uncharged particles in glow discharges; cathodic vacuum arc evaporator; surface modification of plastics (polypropylene); DLC coatings; formation of nanoparticles. Proceedings are available from TU Ilmenau.
8th World Printed Circuit Conference - ECWC8 in Tokyo, Sept. '99
General overview also notes that portable video phones are now on sale in Japan. Four conf. themes were: HDI printed circuit boards; process technology; technical innovations; management themes. Sketch compares ALIVH technology with conventional Build-up, key parameters of ALIVH are listed. The NEC process for manufacture of high density boards is sketched for each mainstage which SEM's showing NEC solder bump for microvia board production. Histogram compares thermal coefficient of expansion of wide range of substrate & related materials.
8th World Printed Circuit Conference - ECWC8 in Tokyo, Sept. '99
General overview also notes that portable videophones are now on sale in Japan. Four conf. themes were: HDI printed circuit boards; process technology; technical innovations; management themes. Sketch compares ALIVH technology with conventional Build-up, key parameters of ALIVH are listed. The NEC process for manufacture of high density boards is sketched for each mainstage which SEM's showing NEC solder bump for microvia board production. Histogram compares thermal coefficient of expansion of wide range of substrate & related materials.